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Technological Advances and Challenges in Chemical Mechanical Polishing

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dc.contributor.author Nadimi Bavil Oliaei, Samad
dc.contributor.author Mukhtarkhanov, Muslim
dc.contributor.author Perveen, Asma
dc.date.accessioned 2023-11-29T12:27:05Z
dc.date.available 2023-11-29T12:27:05Z
dc.date.issued 2020
dc.identifier.citation Nadimi Bavil Oliaei, Samad; Mukhtarkhanov, Muslim; Perveen, Asma. "Technological Advances and Challenges in Chemical Mechanical Polishing", in Advances in Abrasive Based Machining and Finishing Processes, Springer, pp. 235-253, 2020. tr_TR
dc.identifier.uri http://hdl.handle.net/20.500.12416/6690
dc.description.abstract It has been already several decades since chemical mechanical polishing (CMP) process has been deployed as a planarization technique for the fabrication of integrated circuit (IC) in the semiconductor industries. CMP is considered to be a wet polishing technique that has the capability to generate ultrafine surfaces for numerous materials using the combined effect of chemical and mechanical interactions. As CMP involves both mechanical and chemical actions, the process efficiency of CMP also varies with the parameters involved with mechanical and chemical aspects. This chapter presents an overview of CMP technology, working principles, its recent advancement status in terms of green slurry development, abrasives development, new polishing method, research trends and challenges. tr_TR
dc.language.iso eng tr_TR
dc.rights info:eu-repo/semantics/closedAccess tr_TR
dc.subject Wafer tr_TR
dc.subject Surface tr_TR
dc.subject Planarization tr_TR
dc.subject Abrasives tr_TR
dc.subject Polishing tr_TR
dc.title Technological Advances and Challenges in Chemical Mechanical Polishing tr_TR
dc.type bookPart tr_TR
dc.relation.journal Advances in Abrasive Based Machining and Finishing Processes tr_TR
dc.identifier.startpage 235 tr_TR
dc.identifier.endpage 253 tr_TR
dc.contributor.department Çankaya Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümü tr_TR


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