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Molecular dynamics study of a thermal expansion coefficient: Ti bulk with an elastic minimum image method

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dc.contributor.author Hundur, Yakup
dc.contributor.author Hippler, Rainer
dc.contributor.author Güvenç, Ziya B.
dc.date.accessioned 2016-04-01T08:04:31Z
dc.date.available 2016-04-01T08:04:31Z
dc.date.issued 2006-05
dc.identifier.citation Hundur, Y., Hipper, R., Güvenç, Z.B. (2006). Molecular dynamics study of a thermal expansion coefficient: Ti bulk with an elastic minimum image method. Chinese Physics Letters, 23(5), 1068-1071. http://dx.doi.org/10.1088/0256-307X/23/5/002 tr_TR
dc.identifier.issn 0256-307X
dc.identifier.uri http://hdl.handle.net/20.500.12416/809
dc.description.abstract Linear thermal expansion coefficient (TEC) of Ti bulk is investigated by means of molecular dynamics simulation. The elastic minimum image convention of periodic boundary conditions is introduced to allow the bulk to adjust its size according to the new fixed temperature. The TEC and the specific heat of Ti are compared to the available theoretical and experimental data. tr_TR
dc.language.iso eng tr_TR
dc.publisher IOP Publishing LTD tr_TR
dc.relation.isversionof 10.1088/0256-307X/23/5/002 tr_TR
dc.rights info:eu-repo/semantics/openAccess
dc.subject Titanium tr_TR
dc.title Molecular dynamics study of a thermal expansion coefficient: Ti bulk with an elastic minimum image method tr_TR
dc.type article tr_TR
dc.relation.journal Chinese Physics Letters tr_TR
dc.contributor.authorID 29853 tr_TR
dc.identifier.volume 23 tr_TR
dc.identifier.issue 5 tr_TR
dc.identifier.startpage 1068 tr_TR
dc.identifier.endpage 1071 tr_TR
dc.contributor.department Çankaya Üniversitesi, Mühendislik Fakültesi, Elektronik ve Haberleşme Mühendisliği tr_TR


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